Committees > Technical Committee chairs

Technical committee chairs:

Marise BAFLEUR LAAS-CNRS FR
Hélène FREMONT IMS Bordeaux

A - Quality and Reliability assessment techniques and methods for Devices and Systems 

Ninoslav STOJADINOVIC University of Nis
Jean-Luc MURARO Thales Alenia Space - Toulouse FR

B – Semiconductor Failure Mechanisms & Reliability

Alain BRAVAIX ISEN Toulon
Eckhard LANGER Globalfoundries

C – Progress in Failure Analysis: Defect Detection and Analysis

Olivier CREPEL airbus.com
Ingrid DE WOLFIMEC
Frank ALTMANN Fraunhofer imws

D – Reliability of Microwave and wide band-gap devices

Matteo MENEGHINI University of Padova
Nathalie MALBERT IMS Bordeaux

E - Packaging and Assembly Reliability and Failure Analysis

Alexandrine GUEDON-GRACIA IMS Bordeaux
Rene RONGEN NXP Netherlands

F - Power Devices Reliability and Failure Analysis

Mauro CIAPPA ETHZ
Patrick TOUNSI LAAS 
Loïc THEOLIER IMS Bordeaux

G – Photonics Reliability

Massimo VANZI University of Cagliari
Christelle AUPETIT-BERTHELEMOT University of Limoges

H – MEMS and sensors Reliability

George PAPAIOANNOU University of Athens
Christophe POULAIN CEA LETI

I - Extreme environments 

Philippe GALY ST Microelectronics
Tristan DUBOIS IMS Bordeaux