Workshops > Power Workshop

Advanced Packaging and Reliability for Power Devices used in Automotive, Avionics, Traction and Renewables

Organizers: E. Wolfgang (ECPE, Germany), M. Ciappa (ETH Zürich, Switzerland)

Introduction (Eckhard Wolfgang)

Requirement for Interconnects (Mauro Ciappa)

i) Solders:

Daniel Feil et al "Sn-Cu diffusion soldering"/ Bosch, Renningen, Germany

ii) Bond Wires:

Andreas Middendorf et al "Laser cuts in heavy wire bonds"/ Fraunhofer IZM, Berlin, Germany

Reliability tests:

Marion Junghaenel "PC - impact of load pulse duration"/ SEMIKRON, Nuremberg, Germany

Philipe Pougnet "PC tester for in-situ ageing detection"/ Valeo-Siemens, France (Invited)

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