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Program > Program SummaryThe Technical Programme of ESREF 2017 has been defined by the Technical Programme Committee (TPC) organised in nine sub-committees with more than 194 experts in the field of reliability of electronic devices and systems. The TPC has processed to a careful selection from 229 extended summaries of 92 papers to be presented during oral sessions and 38 as posters. Afterwards, authors of accepted papers have carefully addressed the reviewer’s comments in the manuscript submitted for this special issue and a strict reviewing of manuscripts has been implemented with the Elsevier Editorial System by two anonymous reviewers. The overall quality of this special issue has been improved thanks to the commitment and expertise of all contributors and to the editorial effort provided by the ESREF 2017 Guest Editor team and the Elsevier staff. Accepted papers, from all around the world are covering the following topics: Session A - Quality and Reliability assessment techniques and methods for Devices and Systems Session B – Semiconductor Failure Mechanisms & Reliability: Defect analysis from devices to product, Circuit reliability analysis Session C – Progress in Failure Analysis: Defect detection and analysis Session D – Reliability of SiC devices, millimetre wave power devices and high power GaN devices Session E – Interconnections and new failure mechanisms Session F - Power Devices Reliability and Failure Analysis: Interconnections, model and simulations, power devices and modules Session G – Photonic devices Reliability Session H – MEMS Reliability Session I - Extreme environments: Ionising radiation, EMC, ESD, Electric Fast Transient
The main focus in 2017 is reliability assessment of embedded systems in harsh environments required by automotive, avionics and space applications. On Monday September 25th, two tutorials are offered to allow attendees refreshing and expanding their knowledge on the following topics: “Simulation of Packaging under Harsh Environment Conditions (Temperature, Pressure, Corrosion and Radiation)” by Kirsten Weide-Zaage, RESRI Group, Institute of Microelectronic Systems (IMS), Leibniz Universität Hannover, 30167 Hannover “The impacts of EMC/ESD on embedded systems: a challenge for safe systems achievement” by Geneviève Duchamp, IMS Lab - Université de Bordeaux, Fabrice Caignet, LAAS-CNRS Toulouse Seven Invited speakers who are recognised experts in their fields give an overview of the state-of-the-art and special focus on advanced research work. The key note speech opens the conference on Monday, September 25th. Each invited talk focuses on leading work in the areas of: Key Note paper “Enabling robust automotive electronic components in advanced CMOS nodes” by Vincent Huard a,*, S. Mhira a,*, F. Cachoa, A. Bravaix*, (a) STMicroelectronics, France, * REER, IM2NP-ISEN, CNRS, France “Review of the impact of microstructure of lead-free solder joints on assessment of fatigue lives of the solder joints by simulations and thermal cycling tests” by Per-Erik Tegehall, Swerea IVF, Sweden “Aerospace trends are moving fast towards no more custom ICs to high reliability automotive solutions” by R. Enrici Vaion(a), M. Medda(a), A. Pintus(a), A. Mancaleoni(a), G. Mura(b), (a) STMicroelectronics, Agrate Brianza, (b) University of Cagliari “Reconsideration of TDDB Reliability of Gate Dielectrics: Mechanisms and Statistics” by Kenji Okada, TowerJazz Panasonic Semiconductor (TPSCo), Japan “Technologies of IoT - Challenges and Chances for Fault Isolation” by Christian Boit, Technische Universität Berlin, Berlin, Germany “Reliability and Qualification of Microphotonics for Space Applications - A New Challenge” by Iain McKenzie, ESTEC-European Space Agency, Noordwijck, The Netherlands A review of Vth instabilities in GaN MISHEMTs by Clemens Ostermaier, Infineon Villach, Germany
Based on an exchange agreement with the committees of the International Symposium on the Physical & Failure Analysis of Integrated Circuits Conference (IPFA 2017), the International Reliability Physics Symposium (IRPS 2017), the authors of awarded papers are invited to present their work at ESREF 2017. These exchanges prove the fruitful collaboration between the Committees of these three conferences. According to its tradition, ESREF continues to provide an interactive forum to the participants to define the state-of-the-art of leading topics in the reliability field. Several workshops organised in correlation with the ESREF 2017 committee give you a chance to hear about the vision and the roadmap of several key industries handling high TRL products, challenged by research laboratories and academics proposing low TRL innovative constructions.
Exhibition with state-of-art equipment starts on Monday afternoon and hosts coffee breaks, lunches and the poster session to optimise interaction between attendees and exhibitors. Exhibitor flash presentations are scheduled on Tuesday morning and afternoon to allow exhibitors presenting their activity and know-how. Finally, we should like to thank all our sponsors, who have allowed setting-up this high-quality programme:
All the members of the Programme and of the Technical Committees, all the reviewers and the Corresponding Members deserve our congratulations and our thanks for their involvement and their efforts to make ESREF meet the requirements of an international event dedicated to Quality and Reliability of Electron Devices. We are looking forward to welcoming you in Bordeaux for a memorable experience !
Nathalie Labat., ESREF 2017 Chair François Marc, ESREF 2017 Vice-Chair Hélène Frémont and Marise Bafleur, ESREF 2017 Technical program chairs
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