Authors's corner > Scope of papers

A - Quality and Reliability assessment techniques and methods for Devices and Systems

Design for reliability, Built-in reliability,

Virtual qualification, Reliability simulation,

Advanced models for Reliability prediction,

Reliability test structures, Limits to accelerated tests,

Screening methods, Yield/reliability relationship,

Obsolescence, Counterfeit.

B – Semiconductor Failure Mechanisms & Reliability

Process-related issues, Passivation stability,

Hot carriers injection, NBTI, TDDB,

High-K dielectrics and gate stacks,

Low-K dielectrics and Cu interconnects,

Metal migration: mechanical and thermal aspects,

Non-volatile and programmable cells,

Silicon on Insulator devices,

Nano-electronics, Nano-electronic materials for solid state devices.

C – Progress in Failure Analysis: Defect Detection and Analysis

Electron, ion and optical beam techniques,

Scanning probe techniques,

Static or dynamic techniques, Backside techniques,

Acoustic microscopy,

Electric or magnetic field based techniques,

Electrical, thermal and thermo-mechanical characterization,

Sample preparation, construction analysis,

Failure analysis: case studies.

D – Reliability of Microwave and wide band-gap devices

Wide band gap semiconductors,

Microwave and compound semiconductor devices,

E - Packaging and Assembly Reliability and Failure Analysis

Electrical Modeling & Simulations,

Mechanical Modeling & Simulations,

3D / TSV, Flip chip, Advanced substrates,

Chip/package interaction.

F - Power Devices Reliability and Failure Analysis

Smart-power devices, IGBT, thyristors,

High voltage devices,

Thermal management.

G – Photonics Reliability

Solar Cells and Display,

Optoelectronics,

Organic electronics: OLED, Electronic Ink, TFT

H – MEMS and sensors Reliability

Bio-electronics, Bio-sensors, Nano-Bio-technologies,

MEMS and MOEMS,

NEMS and nano-objects.

I - Extreme environments

ESD-EOS,

EMC-EMI,

Radiation impact on circuits and systems reliability.