Workshops > Power Workshop

Advanced Packaging and Reliability for Power Devices used in Automotive, Avionics, Traction and Renewables 

Organizers: E. Wolfgang (ECPE, Germany), M. Ciappa (ETH Zürich, Switzerland)

Introduction (Eckhard Wolfgang)

Requirement for Interconnects (Mauro Ciappa)

i)   Solders:

Daniel Feil et al "Sn-Cu diffusion soldering"/ Bosch, Renningen, Germany

ii)  Bond Wires:

Andreas Middendorf et al "Laser cuts in heavy wire bonds"/ Fraunhofer IZM, Berlin, Germany

Reliability tests:

Marion Junghaenel "PC - impact of load pulse duration"/ SEMIKRON, Nuremberg, Germany

Philipe Pougnet "PC tester for in-situ ageing detection"/ Valeo-Siemens, France (Invited)

Online user: 1