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Workshops > Photonics workshop

WORKSHOP

"Photonic devices and systems: up-to-date technologies, challenges, environment risks and reliability"

Moderators: Prof. Laurent Béchou (IMS Lab, University of Bordeaux, France – CNRS LN2 University of Sherbrooke, Canada), Dr Alain Bensoussan (IRT Saint Exupéry and Thales Alenia Space, Toulouse, France).  

This workshop is a chance to hear about the vision and the roadmap of several key industries handling high TRL products, challenged by research laboratories and academics proposing low TRL innovative constructions. It is expected to stimulate links and collaborative studies between System Manufacturers, Agencies, Academic Laboratories, Research Centers and End-users acting in the fields of aeronautics, space, automotive and ground application industries.

Call for workshop presentations

All contributions will be very welcome. Please send your proposals (before May 1st) to: laurent.bechou@u-bordeaux.fr or alain.bensoussan@irt-saintexupery.com.

Three main topics will be considered:

  • High reliable active optoelectronic devices: needs, challenges and methodologies for a short-term industrialization.
  • Optical sensing technologies for Aeronautics/Space and Automotive applications: current trends and reliability requirements.
  • Silicon photonics packaging: Sharing visions on efficient “built-in reliability” methodologies.

The work space will be organized in several discussions with interactive talks on selected topics. Each panel member will be invited to share its experience and advice in the field selected. A final round-table discussion will conclude the workshop.

Scope of the workshop

The scope of this workshop will focus on up-to-date technologies, main challenges, environment risks and reliability assessment of key photonic technologies.

  • Optolectronics systems for telecom market based on Photonic devices are becoming increasingly pervasive in a wide range of applications but reliability is still a critical issue for their expansion. Reliability assessment of passive or active devices, integrated optics as well as micro-assembled sub-systems, is undoubtedly identified as one of the major factors conditioning the on-going development of photonics. Manufacturability, producibility, testability, industrialization as well as demonstration of a satisfactory operational reliability regarding actual severe environments is one challenge industry and system makers are daily faced to such issues covering extremely large scientific fields as for instance physics, material science, electrical transport, thermal and thermomechanical stress management, coupling interfaces between optics and electronics, qualification testing, statistical models, failure mechanisms, etc. Speakers will present up-to-date technologies, challenges for industrialization as well as qualification testing of advanced devices.
  • A second market of interest related to photonic systems addresses fiber technologies and optical sensing including more and more integrated devices. This industry has experienced a tremendous amount of innovation over the past five decades. Initially conceived for medical endoscopic applications, optical fibers were considered in the mid-1960s as an adequate technology for telecommunications applications. Other application based on strain and temperature measurements are main concern for the performance and condition assessment of different concrete structures and system health monitoring. In addition, optical sensing based on label-based detection schemes (fluorescence, plasmonic resonance…) or label-free sensing (ex. evanescent field detection microresonators) are promising technologies fitting highly sensitive, portable, selective, reusable, multiplexed, rapid and low cost sensors criteria. Speakers will discuss technology transfer, safety and reliability of optical fibers and optical sensing in Aeronautics/Space & Automotive Testing.
  • Breakthrough industry markets in the photonic domain are strongly pushed by packaging and assembly technologies. Packages provide platforms for interconnecting or integrating different devices supporting the following major functions: distributions of optical and electrical signals, coupling stability, power delivery, heat dissipation, environmental protection and functional testing. Packaging can also take up the dominant part of the costs in a photonic component and package materials as well as design are critical in ensuring whether a photonic component passes through qualification and reliability tests. Spanning across the entire production chain of integrated photonics, from technology level to packaging and qualification, speakers will provide a broad range view, envisioning short and medium term perspectives in the photonics exploitation roadmap.

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