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Technical program

The conference will focus on two main areas of interest in electronics concerning designers, manufacturers and users:

- Strategy for Quality and Reliability Assessment during Product Development and Life Cycle

- Advanced Analysis Techniques for Technologies and Product Evaluation

A specific emphasis will be placed on Space, Aeronautics and Embedded System related topics.


Sub-committee Chairs

A - Quality and Reliability assessment techniques and methods for Devices and Systems

Ninoslav Stojadinovic University of Nis
Jean-Luc MURARO Thales Alenia Space - Toulouse FR

B – Semiconductor Failure Mechanisms & Reliability

Alain Bravaix ISEN Toulon
Eckhard Langer Globalfoundries

C – Progress in Failure Analysis: Defect Detection and Analysis

Olivier Crepel airbus.com
Ingrid De Wolf IMEC
Frank Altmann Fraunhofer imws

D – Reliability of Microwave and wide band-gap devices

Matteo Meneghini University of Padova
Nathalie Malbert IMS Bordeaux

E - Packaging and Assembly Reliability and Failure Analysis

Alexandrine GUEDON-GRACIA IMS Bordeaux
Rene RONGEN NXP Netherlands

F - Power Devices Reliability and Failure Analysis

Mauro CIAPPA ETHZ
Patrick TOUNSI LAAS 
Loïc THEOLIER IMS Bordeaux

G – Photonics Reliability

Massimo VANZI University of Cagliari
Christelle AUPETIT-BERTHELEMOT University of Limoges

H – MEMS and sensors Reliability

George PAPAIOANNOU University of Athens
Christophe POULAIN CEA LETI

I - Extreme environments

Philippe GALY ST Microelectronics
Tristan DUBOIS IMS Bordeaux

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